Quality inspectors meticulously examine components to verify that part dimensions, markings, leads, packaging, and other characteristics are consistent with manufacturer specifications.

Stereo and high-powered microscopes can magnify up to 500x to detect blacktopping, sanding, oxidation, and retinning.

High-definition microscopes can reproduce views as 60x HD images, allowing us to inspect components with unsurpassed color rendition and no distortion, delay, or interference.

With an integrated 2D/3D measurement system and extremely high depth of field, our high-magnification HD/3D microscope can capture any area in complete focus.

X-ray images are compared against OEM parts and are also used to verify that no voids have formed and to confirm leads and bond wires.

XRF machine measures coating systems to determine coating thickness and composition and analyzes material content for small structures and small components.

C-SAM acoustic microscopy uses pulse-echo imaging to detect voids, cracks, and delaminations and penetrate blacktopping to expose markings.

Curve tracer performs reliability analysis, verifies pins and electrical continuity, and analyzes anomalous characteristics.

Decapsulation is used to verify die size and manufacturers’ logos, inspect the architecture of the die, and confirm part numbers.

Heated-solvent testing exposes signs of counterfeiting by detecting sand marks, texture differences, and blacktopping.

We verify the solderability of component leads to determine coating durability and checks for signs of corrosion and oxidation on aged products to establish usability.

We measure bond strengths and distributions and tests the integrity of materials used to attach dies or surface-mounted passive elements to determine compliance with bond-strength requirements.